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Hidrógeno activado para reflujo sin fundente
Innovación patentada y patentada para aplicaciones de envasado a nivel de oblea, incluido el reflujo de oblea y el reflujo de pilar de cobre
El hidrógeno activado es una nueva tecnología sin fundente basada en la unión de electrones (EA), que puede funcionar a presión ambiente y a las temperaturas normales de reflujo de soldadura utilizando mezclas no inflamables de hidrógeno (menos del 5% del volumen) en nitrógeno.
Soldadura sin fundente mediante tecnología Electron Attachment (EA)
A cost-effective method to reflow your bumped wafers
If you need to improve your productivity and lower your costs, then consider our fluxless Electron Attachment solution, which uses non-flammable hydrogen and nitrogen blends to replace traditional flux chemistries for wafer-level packaging.
Ask the Expert
Greg Arslanian
Global Electronics Industry Manager
“How can I improve my wafer bump/Cu pillar reflow soldering process?”
Building on our 25 years of proprietary and patented innovation for the global electronics packaging industry, Air Products has developed a novel flux-free soldering technology. It uses activated hydrogen at ambient pressure with a starting temperature as low as 100° C to remove metal oxides from electroplated solder bumps and copper pillars on semiconductor wafers and permits reflow of these bumps to obtain the proper shape and size for interconnection onto a package or substrate.
The activated hydrogen technology is a novel flux-free process, which can be operated at ambient pressure and normal solder reflow temperatures using non-flammable mixtures of hydrogen (<5 vol%) in nitrogen. This technology, invented by Air Products, involves generating a large quantity of low-energy electrons. Some of the electrons attach to hydrogen molecules, forming active species for effective oxide removal.
To capitalize on this unique technology, Air Products has partnered with Sikama International to introduce an electron attachment fluxless reflow system (EAUP1200) to the electronics wafer level packaging segment. The furnace is designed to remove metal oxides from solder bumps on UBM wafers and solder caps from copper pillar wafers via the activated hydrogen technology. The activated hydrogen produces hydrogen anions, which induces reflow of the solder to a final shape in the absence of traditional flux processes.
Gases
Hidrógeno
Es muy valorado por sus propiedades reactivas y protectoras. Se utiliza en muchos sectores, como la electrónica, alimentación, vidrio, productos químicos, entre otros, por sus propiedades únicas para mejorar la calidad, optimizar el rendimiento y reducir costes.
Nitrógeno
Útil en fase gas por sus propiedades inertes, y como líquido para refrigeración y congelación. Prácticamente cualquier sector puede beneficiarse de sus propiedades únicas para mejorar los resultados, optimizar el rendimiento y hacer que las operaciones sean más seguras.